Rob Zippo • O:303.797.9700 • C:720.879.1218 E:email@example.com
Full Service Product Development/Engineering
Electrical Engineering & Software Development
Electrical hardware design with focus on High Speed Digital / GHz IO’s, Embedded Processor Designs, Power Designs, Motors AC & DC, Steppers, RF – RFID, WiFi, PGA Development, Software/Firmware Development
Turn-on & test. Standard power up, Design debug & testing, compliance & thermal analysis.
Enclosure Development & Mechanical Hardware Design, Plastic & precision sheet metal & machined parts, Cable Design, 3D Modeling, Prototype & Production tooling & CAD Files for seamless handoff to manufacturing.
PCB Layout & Design
Our PCB design tools include Cadence Allegro, Mentor Graphics & Altium Designer. Component library design & maintenance, High Speed Digital, GHz IO’s, .4mm BGAs, blind & buried vias, Power, Analog, High-Touch, RF – RFID Tags, WiFi, VLSI Test Boards, Flex & Rigid Flex designs, Asic Test Boards, Controlled Impedance
BOM Development, Gerber File & Assembly File Creation.
PCB Fabrication – Prototype
24 hour to 10 day lead-times depending on technology, 3/3 lines & spaces, 30+ layers, Rigid/Flex or Rigid-Flex Designs, Commercial or Military, Blind & Buried vias, Non-conductive filled vias, Impedance control/Stack up Engineering support with TDR Testing, Hi-Aspect Ratio, Heatsinks, Sequential Laminations, Antenna PCBS, Heavy Copper, Edge Plating, Hybrid (mixed material) designs, DFM Feedback
Materials Include: FR-4 (low & hi-temp), Teflon, Polyimide, Rogers, Arlon, Taconic
Surface Finishes include: HASL, ENIG, Immersion Silver, Full body Nickel/Gold, Wire bondable Gold, Conductive Carbon Inks & many RoHs compliant finishes.
6-12 hour quote response time.
Bleeding Edge PCB Fabrication Includes: Ultra-High Aspect Ratio (>34:1), 70+ layer PCBs, Large Format PCBs (up to 54”), Backplanes, HDI with Any-Layer-Via Structures, up to 25 GHz Speeds, Backdrilling, Buried Capacitance/Resistors, Press fit connectors, Heavy copper up to 10 ounces & Semi Automated TDR testing
PCB Fabrication – Offshore production
Taiwan & China factories, 5 day deliveries to anywhere is USA, Low – High volumes, 2/2 lines & spaces, Rigid/Flex or Rigid-Flex PCBS, Metal core, 36+ layers, Stacked vias, Laser drilling, Blind & Buried vias, v-scoring , skip scoring, or punching.
Materials Include: FR-4 (low & hi-temp), Teflon, Polyimide, Rogers, BT, Kapton, Epoxy, Aluminum Core
Surface Finishes include: HASL, ENIG,
Customs fees, Duty, Freight – All inclusive
Stocking programs from Utah based humidity controlled warehouse & JIT Deliveries overnight to maximize annual purchasing power. Pay As You Pull and Vendor Managed Inventories. C of Cs & First Article Inspection (FAI) & Electrical Test reports with every delivery.
24 hour quote response time
Consumer Electronics, Contract Manufacturers, OEMs, Data Storage, Aerospace, Medical, Military, Instrumentation, Semiconductor, Down-Hole, Alternative Energy, Technology Start-ups
Certifications & Specifications
IPC – 1710
IPC-6012 Class II & III
ISO 14001 (environmental)
GeSI (Global e-Sustainability Initiative)
Products & Services